Aprašymas
PCB headers, nominal cross section: 0.5 mm2, color: signal white, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, number of potentials: 7, number of rows: 1, number of positions: 7, number of connections: 7, product range: PTSM 0,5/..-HH-SMD WH, pitch: 2.5 mm, mounting: SMD soldering, pin layout: Linear pad geometry, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard
| Type | Standard |
| Product line | COMBICON Connectors XS |
| Product type | PCB headers |
| Number of positions | 7 |
| Pitch | 2.5 mm |
| Number of connections | 7 |
| Number of rows | 1 |
| Mounting flange | without |
| Number of potentials | 7 |
| Pin layout | Linear pad geometry |
| Solder pins per potential | 1 |
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Degree of pollution | 3 |
| Rated voltage (III/3) | 125 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data – contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 – 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 – 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 – 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 – 3 µm Ni) |
| Material data – housing | |
| Color () | () |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color () | () |
| Dimensional drawing | |
| Pitch | 2.5 mm |
| Width [w] | 23.1 mm |
| Height [h] | 5 mm |
| Length [l] | 9.5 mm |
| Installed height | 5 mm |
| PCB design | |
| Pad geometry | 1.2 x 3.2 mm |
| Pin spacing | 2.50 mm |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | I |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Rated insulation voltage (III/3) | 125 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value – non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 1.9 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value – non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.5 mm |
| Rated insulation voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value – non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 1.6 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C … 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C … 70 °C |
| Relative humidity (storage/transport) | 30 % … 70 % |
| Ambient temperature (assembly) | -5 °C … 100 °C |
| Type of packaging | packed in cardboard |
White design: Stable color when welding and during use|Designed for integration into the SMT soldering process|Supplied in tape-on-reel packing according to IEC 60286-3 for automated mounting|Additional solder anchors reduce the mechanical strain on the soldering spots
