Description
PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Gold, type of contact: Male connector, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: CCV 2,5/..-GF-LR, pitch: 5.08 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: Screw locking, mounting: Threaded flange, type of packaging: packed in cardboard
| Type | Component suitable for through hole reflow |
| Product line | COMBICON Connectors M |
| Product type | PCB headers |
| Number of positions | 5 |
| Pitch | 5.08 mm |
| Number of connections | 5 |
| Number of rows | 1 |
| Mounting flange | Lock & release threaded flange |
| Number of potentials | 5 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Nominal current IN | 12 A |
| Nominal voltage UN | 320 V |
| Degree of pollution | 3 |
| Rated voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| Rated voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| Mounting type | THR soldering |
| Pin layout | Linear pinning |
| Flange | |
| Tightening torque | 0.3 Nm |
| Material data – contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | partially gold-plated |
| Metal surface contact area (top layer) | Gold (0.8 – 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (1 – 3 µm Ni) |
| Metal surface soldering area (top layer) | Gold (0.8 – 1.4 µm Au) |
| Metal surface soldering area (middle layer) | Nickel (1 – 3 µm Ni) |
| Material data – housing | |
| Color () | () |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color () | () |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing | |
| Pitch | 5.08 mm |
| Width [w] | 35.56 mm |
| Height [h] | 14.6 mm |
| Length [l] | 8.57 mm |
| Installed height | 12 mm |
| Solder pin length [P] | 2.6 mm |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| minimum clearance value – non-homogenous field (III/3) | 3 mm |
| minimum creepage distance (III/3) | 4 mm |
| Rated insulation voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| minimum clearance value – non-homogenous field (III/2) | 3 mm |
| minimum creepage distance (III/2) | 3.2 mm |
| Rated insulation voltage (II/2) | 400 V |
| Rated surge voltage (II/2) | 4 kV |
| minimum clearance value – non-homogenous field (II/2) | 3 mm |
| minimum creepage distance (II/2) | 4 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C … 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C … 70 °C |
| Relative humidity (storage/transport) | 30 % … 70 % |
| Ambient temperature (assembly) | -5 °C … 100 °C |
| Type of packaging | packed in cardboard |
Gold-plated contacts ensure transfer quality remains stable over the long term|Designed for integration into the SMT soldering process|Vertical connection enables multi-row arrangement on the PCB|Screwable flange for superior mechanical stability|Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
