Aprašymas
PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, number of potentials: 2, number of rows: 1, number of positions: 2, number of connections: 2, product range: CCA 2,5/..-G, pitch: 5.08 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 32 mm wide tape
| Type | Component suitable for through hole reflow |
| Product line | COMBICON Connectors M |
| Product type | PCB headers |
| Number of positions | 2 |
| Pitch | 5.08 mm |
| Number of connections | 2 |
| Number of rows | 1 |
| Mounting flange | without |
| Number of potentials | 2 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Nominal current IN | 12 A |
| Nominal voltage UN | 320 V |
| Degree of pollution | 3 |
| Contact resistance | 1.3 mΩ |
| Rated voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| Rated voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| Mounting type | THR soldering |
| Pin layout | Linear pinning |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data – contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 – 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 – 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 – 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 – 3 µm Ni) |
| Material data – housing | |
| Color () | () |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color () | () |
| Details for soldering processes | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing | |
| Pitch | 5.08 mm |
| Width [w] | 12.96 mm |
| Height [h] | 11.17 mm |
| Length [l] | 12 mm |
| Installed height | 8.57 mm |
| Solder pin length [P] | 2.6 mm |
| Test for conductor damage and slackening | |
| Specification | IEC 60999-1:1999-11 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60999-1:1999-11 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.2 mm² / solid / > 10 N |
| 0.2 mm² / flexible / > 10 N | |
| 2.5 mm² / solid / > 50 N | |
| 2.5 mm² / flexible / > 50 N | |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 25 |
| Insertion strength per pos. approx. | 8 N |
| Withdraw strength per pos. approx. | 6 N |
| Torque test | |
| Specification | IEC 60999-1:1999-11 |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N |
Test passed |
| Resistance of inscriptions | |
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
| Polarization and coding | |
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 12 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| minimum clearance value – non-homogenous field (III/3) | 3 mm |
| minimum creepage distance (III/3) | 4 mm |
| Rated insulation voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| minimum clearance value – non-homogenous field (III/2) | 3 mm |
| minimum creepage distance (III/2) | 3.2 mm |
| Rated insulation voltage (II/2) | 400 V |
| Rated surge voltage (II/2) | 4 kV |
| minimum clearance value – non-homogenous field (II/2) | 3 mm |
| minimum creepage distance (II/2) | 4 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 – 150 – 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz … 60.1 Hz) |
| Sweep speed | 5g (60.1 Hz … 150 Hz) |
| Test duration per axis | 2.5 h |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 4.8 kV |
| Contact resistance R1 | 1.3 mΩ |
| Contact resistance R2 | 1.4 mΩ |
| Insertion/withdrawal cycles | 25 |
| Climatic test | |
| Specification | ISO 6988:1985-02 |
| Corrosive stress | 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle |
| Thermal stress | 100 °C/168 h |
| Power-frequency withstand voltage | 2.21 kV |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C … 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C … 70 °C |
| Relative humidity (storage/transport) | 30 % … 70 % |
| Ambient temperature (assembly) | -5 °C … 100 °C |
| Dimensional drawing | |
| Type of packaging | 32 mm wide tape |
| [W] tape width | 32 mm |
| [W2] coil overall dimension | 38.4 mm |
| [A] coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
Designed for integration into the SMT soldering process|Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
