Description
PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm2, number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: SPT 1,5/..-H-THR, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear double pinning, Solder pin [P]: 2 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard. SAMPLE set with 5 items in belt section. When used as part of soldering process, please use items without SAMPLE marking
| Product line | COMBICON Terminals S |
| Product type | Printed circuit board terminal |
| Number of positions | 5 |
| Pitch | 3.5 mm |
| Number of connections | 5 |
| Number of rows | 1 |
| Number of potentials | 5 |
| Pin layout | Linear double pinning |
| Solder pins per potential | 2 |
| Nominal current IN | 13.5 A |
| Nominal voltage UN | 160 V |
| Degree of pollution | 3 |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Connection technology | |
| Nominal cross section | 1.5 mm² |
| Conductor connection | |
| Connection method | Push-in spring connection |
| Conductor cross section solid | 0.2 mm² … 1.5 mm² |
| Conductor cross section flexible | 0.2 mm² … 1.5 mm² |
| Conductor cross section AWG | 24 … 16 |
| Conductor cross section flexible, with ferrule without plastic sleeve | 0.2 mm² … 1.5 mm² |
| Conductor cross section, flexible, with ferrule, with plastic sleeve | 0.2 mm² … 0.75 mm² |
| Stripping length | 8 mm |
| Mounting type | THR soldering |
| Pin layout | Linear double pinning |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data – contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | hot-dip tin-plated |
| Metal surface terminal point (top layer) | Tin (4 – 8 µm Sn) |
| Metal surface soldering area (top layer) | Tin (4 – 8 µm Sn) |
| Material data – housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color (Actuating element) | white (9010) |
| Insulating material | PA GF |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Assembly instruction: | This item is not suitable for PCB cleaning with liquids. |
| Dimensional drawing | |
| Pitch | 3.5 mm |
| Width [w] | 18 mm |
| Height [h] | 9.7 mm |
| Length [l] | 13.6 mm |
| Installed height | 7.7 mm |
| Solder pin length [P] | 2 mm |
| PCB design | |
| Pin spacing | 7 mm |
| Connection test | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Test for conductor damage and slackening | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60998-2-2:2002-12 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.2 mm² / solid / > 10 N |
| 0.2 mm² / flexible / > 10 N | |
| 1.5 mm² / solid / > 40 N | |
| 1.5 mm² / flexible / > 40 N | |
| Flexion test | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Temperature-rise test | |
| Specification | IEC 60998-2-1:2002-12 |
| Requirement temperature-rise test | Increase in temperature ≤ 45 K |
| Insulation resistance | |
| Specification | IEC 60998-1:2002-12 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60947-7-4:2013-08 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value – non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value – non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value – non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 3.2 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 – 150 – 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz … 60.1 Hz) |
| Sweep speed | 5g (60.1 Hz … 150 Hz) |
| Test duration per axis | 2.5 h |
| Glow-wire test | |
| Specification | IEC 60998-1:2002-12 |
| Temperature | 850 °C |
| Time of exposure | 5 s |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C … 100 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C … 70 °C |
| Relative humidity (storage/transport) | 30 % … 70 % |
| Ambient temperature (assembly) | -5 °C … 100 °C |
| Type of packaging | packed in cardboard |
Time saving push-in connection, tools not required|Defined contact force ensures that contact remains stable over the long term|Intuitive use through colour coded actuation lever|Designed for integration into the SMT soldering process|Quick and convenient testing using integrated test option|Operation and conductor connection from one direction enable integration into front of device|Two solder pins reduce the mechanical strain on the soldering spots
