Description
PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm2, number of rows: 1, number of positions per row: 4, product range: MKDS 1/..-HT, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: THR soldering, conductor/PCB connection direction: 0 °, Pin layout: Linear pinning, Solder pin [P]: 2 mm, number of solder pins per potential: 1, type of packaging: 24 mm wide tape
| Type | PC termination block |
| Product line | COMBICON Terminals S |
| Product type | Printed circuit board terminal |
| Number of positions | 4 |
| Pitch | 3.81 mm |
| Number of rows | 1 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Nominal current IN | 13.5 A |
| Nominal voltage UN | 200 V |
| Degree of pollution | 3 |
| Rated voltage (III/3) | 63 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 200 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Connection technology | |
| Type | PC termination block |
| Nominal cross section | 1.5 mm² |
| Conductor connection | |
| Connection method | Screw connection with tension sleeve |
| Conductor cross section solid | 0.14 mm² … 1.5 mm² |
| Conductor cross section flexible | 0.14 mm² … 1.5 mm² |
| Conductor cross section AWG | 26 … 16 |
| Conductor cross section flexible, with ferrule without plastic sleeve | 0.25 mm² … 0.5 mm² |
| Conductor cross section, flexible, with ferrule, with plastic sleeve | 0.25 mm² … 0.5 mm² |
| 2 conductors with same cross section, solid | 0.14 mm² … 0.5 mm² |
| 2 conductors with same cross section, flexible | 0.14 mm² … 0.34 mm² |
| Stripping length | 5 mm |
| Tightening torque | 0.22 Nm … 0.25 Nm |
| Mounting type | THR soldering |
| Pin layout | Linear pinning |
| Drive form screw head | Slotted (L) |
| Drive form screw head | Slotted (L) |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 3 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data – contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface terminal point (top layer) | Tin (5 – 7 µm Sn) |
| Metal surface terminal point (middle layer) | Nickel (2 – 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (5 – 7 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (2 – 3 µm Ni) |
| Material data – housing | |
| Color () | () |
| Insulating material | PA |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 250 – 399 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color () | () |
| Note on application | For safe conductor connection, always adhere to a defined tightening torque. Particularly in the case of PCB terminal blocks with two or three positions, the individual solder pin for each contact point cannot compensate for this. That is why the terminal blocks must be supported during conductor connection (held with one hand, support on the housing). |
| Dimensional drawing | |
| Pitch | 3.81 mm |
| Width [w] | 15.23 mm |
| Height [h] | 10.5 mm |
| Length [l] | 7.3 mm |
| Installed height | 8.5 mm |
| Solder pin length [P] | 2 mm |
| PCB design | |
| Pin spacing | 3.5 mm |
| Test for conductor damage and slackening | |
| Specification | IEC 60998-2-1:1990-04 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60998-2-1:1990-04 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.14 mm² / solid / > 10 N |
| 0.14 mm² / flexible / > 10 N | |
| 1.5 mm² / solid / > 40 N | |
| 1 mm² / flexible / > 35 N | |
| Torque test | |
| Specification | IEC 60998-2-1:1990-04 |
| Temperature-rise test | |
| Specification | IEC 60998-1:2002-12 |
| Requirement temperature-rise test | Increase in temperature ≤ 45 K |
| Insulation resistance | |
| Specification | IEC 60998-2-1:1990-04 |
| Insulation resistance, neighboring positions | 109 Ω |
| Air clearances and creepage distances | | |
| Specification | IEC 60947-1:2007-06 + A1:2010-12 + A2:2014-09 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 250 – 399 |
| Rated insulation voltage (III/3) | 63 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value – non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2 mm |
| Rated insulation voltage (III/2) | 200 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value – non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 2 mm |
| Rated insulation voltage (II/2) | 200 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value – non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:1995-03 |
| Frequency | 10 – 150 – 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz … 60.1 Hz) |
| Sweep speed | 5g (60.1 Hz … 150 Hz) |
| Test duration per axis | 2.5 h |
| Glow-wire test | |
| Specification | IEC 60998-2-1:1990-04 |
| Temperature | 850 °C |
| Time of exposure | 5 s |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C … 100 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C … 70 °C |
| Relative humidity (storage/transport) | 30 % … 70 % |
| Ambient temperature (assembly) | -5 °C … 100 °C |
| Dimensional drawing | |
| Type of packaging | 24 mm wide tape |
Well-known connection principle allows worldwide use|Low temperature rise, thanks to maximum contact force|Allows connection of two conductors|Extremely small design for the respective conductor cross section|Designed for integration into the SMT soldering process
