Description
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: MCV 1,5/..-GF-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking, mounting: Threaded flange, type of packaging: 56 mm wide tape, For user information and design recommendations for through-hole reflow technology, go to: Downloads
| Type | Component suitable for through hole reflow |
| Product line | COMBICON Connectors S |
| Product type | PCB headers |
| Number of positions | 8 |
| Pitch | 3.81 mm |
| Number of connections | 8 |
| Number of rows | 1 |
| Mounting flange | Threaded flange |
| Number of potentials | 8 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Nominal current IN | 8 A |
| Nominal voltage UN | 160 V |
| Degree of pollution | 3 |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Mounting type | THR soldering |
| Pin layout | Linear pinning |
| Flange | |
| Tightening torque | 0.3 Nm |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data – contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 – 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 – 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 – 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 – 3 µm Ni) |
| Material data – housing | |
| Color () | () |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color () | () |
| Details for soldering processes | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Dimensional drawing | |
| Pitch | 3.81 mm |
| Width [w] | 40.87 mm |
| Height [h] | 11.2 mm |
| Length [l] | 7.25 mm |
| Installed height | 9.2 mm |
| Solder pin length [P] | 2 mm |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value – non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value – non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value – non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2.5 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C … 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C … 70 °C |
| Relative humidity (storage/transport) | 30 % … 70 % |
| Ambient temperature (assembly) | -5 °C … 100 °C |
| Dimensional drawing | |
| Type of packaging | 56 mm wide tape |
| [W] tape width | 56 mm |
| [W2] coil overall dimension | 62.4 mm |
| [A] coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
Designed for integration into the SMT soldering process|Screwable flange for superior mechanical stability|Vertical connection enables multi-row arrangement on the PCB|Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
