Description
Feed-through header, nominal cross section: 2.5 mm2, color: green, rated voltage (III/2): 320 V, contact surface: Gold, type of contact: Male connector, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: DFK-MSTB 2,5/..-G, pitch: 5.08 mm, connection method: Solder/Slip-on connection, mounting: Direct mounting, solder pin [P]: 9.3 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard
| Product line | COMBICON Connectors M |
| Product type | Feed-through header |
| Number of positions | 5 |
| Pitch | 5.08 mm |
| Number of connections | 5 |
| Number of rows | 1 |
| Mounting flange | without |
| Number of potentials | 5 |
| Solder pins per potential | 1 |
| Degree of pollution | 3 |
| Rated voltage (III/3) | 320 V |
| Rated surge voltage (III/3) | 4 kV |
| Rated voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| Mounting type | Direct mounting |
| Attachment to feed-through panel | |
| Tightening torque | 0.3 Nm |
| Screw | 0708263 DFK-MSTB SS for housing walls of up to 6 mm thick |
| Material data – contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Completely gold-plated |
| Metal surface contact area (top layer) | Gold (0.8 – 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (2 – 4 µm Ni) |
| Metal surface soldering area (top layer) | Gold (0.8 – 1.4 µm Au) |
| Metal surface soldering area (middle layer) | Nickel (2 – 4 µm Ni) |
| Material data – housing | |
| Color () | () |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V2 |
| Material data – actuating element | |
| Color () | () |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing | |
| Pitch | 5.08 mm |
| Width [w] | 45.72 mm |
| Height [h] | 29.5 mm |
| Length [l] | 17.5 mm |
| Installed height | 20.2 mm |
| Solder pin length [P] | 9.3 mm |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | I |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Rated insulation voltage (III/3) | 320 V |
| Rated surge voltage (III/3) | 4 kV |
| minimum clearance value – non-homogenous field (III/3) | 3 mm |
| minimum creepage distance (III/3) | 4 mm |
| Rated insulation voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| minimum clearance value – non-homogenous field (III/2) | 3 mm |
| minimum creepage distance (III/2) | 3 mm |
| Rated insulation voltage (II/2) | 630 V |
| Rated surge voltage (II/2) | 4 kV |
| minimum clearance value – non-homogenous field (II/2) | 3 mm |
| minimum creepage distance (II/2) | 3.2 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C … 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C … 70 °C |
| Relative humidity (storage/transport) | 30 % … 70 % |
| Ambient temperature (assembly) | -5 °C … 100 °C |
| Type of packaging | packed in cardboard |
| Type of packaging | packed in cardboard |
Gold-plated contacts ensure transfer quality remains stable over the long term|Free choice – permanent solder connection or standardized slip-on connection|Maximum flexibility when it comes to device design – one header for connectors with different connection technologies|Cable connection on the inside of the device enables flexible positioning of the panel feed-through
