Phoenix contact

Covering hood, for the contact and dust-protected encapsulation of the components, in green design. Height: 52 mm, width: 12.5 mm..

Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. Height: 7.5 mm, width: 25 mm..

Covering hood, for the contact and dust-protected encapsulation of the components, in green design. Height: 52 mm, width: 25 mm..

Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. Height: 7.5 mm..

Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. Height: 15 mm, width: 37.5 mm..

Covering hood, for the contact and dust-protected encapsulation of the components, in green design. Height: 52 mm, width: 37.5 mm..

Relay Module..

Electronic housing, for PCB insertion, without screw connection terminal blocks and cover..

Custom circuit module, consisting of housing, MKDS 3 connection terminal blocks and PCB..

Custom circuit module, consisting of housing, MKDS 3 connection terminal blocks and PCB..

PCB for assembling electronic components..

Relay module, with soldered-in miniature switching relay, contact (AgNi): medium to large loads, double A2 connection, 1 changeover contact, input voltage 12 V AC/DC..

Relay module, with soldered-in remanence miniature switching relay, with positive switching diode wiring, contacts (AgSnO): small to large loads, 1 changeover contact, input voltage 60 V DC..

Equipment marker, narrow..

Lamp test module, 8 diodes with common cathode and 8 diodes with common anode: 8-pair version, customer-specific wiring..

Relay module, with soldered-in miniature switching relay, contact (AgNi+Au): small to large loads, 2 changeover contacts, input voltage 24 V AC/DC..

Relay module, with soldered-in miniature switching relay, contact (AgNi+Au): small to large loads, 1 changeover contact, input voltage 24 V AC/DC..

Custom circuit module, consisting of housing, MKDS 3 connection terminal blocks and PCB..

Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. Height: 7.5 mm..

Covering hood, for the contact and dust-protected encapsulation of the components, in green design. Height: 52 mm, width: 10 mm..